Returning to Dominate The World With My Knowledge System
Chapter 63: Heimdall Schematics

Chapter 63: Chapter 63: Heimdall Schematics

Tyler arrived at the fabrication facility just after sunrise.

While the team began assembling the remaining nine non-volatile DRAM-based NVMe modules, Tyler headed straight into his private office.

The door shut quietly behind him, cutting off the ambient noise of machinery and focused chatter.

Today was pivotal for him.

He didn’t need to wait until the NVMe modules were complete to start the next phase.

In fact, he couldn’t afford to. Time was moving, and if he wanted to get his AI running in a custom-built system that wouldn’t fry itself, he needed to get ahead.

He booted up his laptop, opened his schematic design software, and brought up a blank canvas. Then, he began drawing.

The task at hand was not minor. Tyler was about to design a motherboard that had no equivalent on Earth.

No retail part, no enthusiast board, no server-grade PCB even came close to what he needed.

He took a deep breath and got to work.

First, abandoning traditional standards

Tyler’s first decision was brutal but necessary: complete rejection of consumer motherboard architecture.

PCIe lanes? Obsolete. DIMM slots? Dead weight. SATA? Completely useless.

Everything available in 2010—even cutting-edge tech—would bottleneck or outright combust under the requirements of his system.

The Valkyrie-X chips alone demanded more bandwidth than an entire datacenter switchboard.

Ten of them? It was madness. Add in 64TB of stacked DRAM towers and 192TB of experimental NVMe DRAM, and it became clear: he needed to start from the absolute bottom.

No modules or compatibility. Everything had to be native.

Second, custom backplane with GPIC Lanes

The foundation of the system would be a custom backplane—layered and flat—with integrated GPIC lanes (General Parallel Integrated Corelines).

These weren’t modular slots like PCIe; they were precision-etched tunnels directly in the board, connecting power, signal, and cooling infrastructure as a single, unified pipeline.

Each GPIC lane was designed to receive one Valkyrie-X chip directly into a vertical chamber—complete with liquid flow nodes, data uplinks, and multiphase power gates.

No need for GPU risers. No bottlenecks. Every chip spoke directly to the board as if it were part of its nervous system.

Third, multi-tiered bus matrix

Bandwidth was the next nightmare.

As for PCIe 2.0, this was barely functional for one Valkyrie-X.

Instead, Tyler designed a multi-tiered crossbar switch matrix, essentially a web of dynamic communication lanes between compute, memory, and storage arrays.

Every major component would have a dedicated route, avoiding congestion and maximizing throughput.

To push it further, he added optical interconnects—glass-thin photonic pathways embedded into the board to allow light-speed signaling between GPU and DRAM cores.

It was experimental, sure, but possible—especially with [Computational Mathematics].

The result? Parallel compute clusters and memory stacks could exchange data in nanoseconds, even during AI-level processing spikes.

The next was the power regulation redesign

Ten Valkyrie-X chips is a peak draw of 1,500W each and a total system peak of 15,000W.

Any attempt to use traditional ATX power rails would lead to instant meltdown—literally.

Tyler drafted a multi-point, multiphase power gating system, assigning localized voltage regulators to each major component cluster.

Instead of aluminum traces, he embedded graphene-based power delivery rails inside the motherboard’s substrate—capable of handling kilowatt-scale loads with minimal resistance.

He also layered in a supercapacitor-based failover matrix—an emergency circuit that would absorb spikes during startup or AI load surges, acting like an invisible fuse box that reset itself without ever tripping.

The next was need for an embedded cooling infrastructure

Tyler had already integrated microchannels into the Valkyrie-X chambers. Now he expanded it board-wide.

The motherboard would have a liquid microchannel grid running throughout its interior.

Like blood vessels in a body, these channels would circulate coolant through every high-heat zone.

A thermal pipe routing system would connect each GPU, DRAM tower, and NVMe socket to external cooling systems.

He embedded smart thermal sensors throughout the board, each tied into an algorithmic cooling AI—one designed to monitor, predict, and react to heat spikes in real time.

Standard fans? Irrelevant.

Another thing that are needed are embedded vontrollers and custom firmware

A board this advanced couldn’t run on BIOS or even UEFI. It would crash before it booted.

Tyler designed Heimdall Core, a supervisory firmware system to replace BIOS entirely.

Heimdall would control startup sequences, security handshakes, memory mapping, live diagnostics, and failover routines.

Each sector of the motherboard would contain embedded controllers—small RISC-style CPUs Tyler could fabricate in the fab. They’d manage the local hardware segment they were built into.

As for those curious, Tyler’s naturally going to create a custom OS, as there’s no way that normal operating systems would run on a device as advanced as what he’s building. And even if by miracle, it can, Tyler won’t use it as he doesn’t want anyone stealing his data

Next was the memory address translation

With 256TB of addressable memory (64TB volatile + 192TB non-volatile), there was no chance in hell a 64-bit controller could handle it.

Tyler implemented segmented memory banks, each with dedicated page tables and dynamic address translators.

Four parallel memory management cores would share the load, ensuring stability.

To top it off, he added a neuromorphic memory prediction algorithm. This algorithm AI-driven controller would learn and anticipate data access patterns from the AI itself, preloading critical instruction sets and datasets to avoid latency.

Next was the material selection for the device’s physical design.

Standard fiberglass PCB? Laughable.

Tyler specified boron nitride composite substrates for their high thermal resistance and electromagnetic shielding.

He layered sensitive zones in diamond-like carbon coatings to prevent EM interference, then reinforced the whole structure with titanium-alloy plates to prevent board warping.

Component integration chambers were designed next—each one a vertical dock that included power, cooling, and data routing.

Tyler planned to insert each component into these "nests" rather than soldering or slotting them.

To prevent hot spots, he embedded automated pressure equalizers, which would balance thermal load during operation and prevent chip fracture.

Then for the fabrication strategy, with the full schematic finally complete, Tyler shifted into planning mode.

Some elements, like the board printing and GPIC lanes, he could fabricate directly in the fab. His modified etching systems were already capable of sub-nanometer precision.

Liquid channels, cooling paths, component sockets, and graphene rails—all feasible in-house.

But some things, like boron nitride sheets and mini supercapacitors, needed to be sourced externally. Tyler added them to the list David would handle.

The optical interlinks were trickier, but he could get away with embedding a few light-based lanes between GPU clusters and DRAM towers. The rest would use enhanced copper and carbon composites.

...

Finally, after hours of focused work, Tyler leaned back in his chair and stretched. His spine popped, his arms ached, giving him that sweet feeling that comes with it.

He turned to look at the schematic on his screen and he that it was beautiful. It was like something out of a post-singularity warship.

He saved the file under one name:

Project Heimdall – Core Motherboard v1.0

Tyler stood and exhaled slowly. He still needed to check on the team. If the remaining nine storage modules were done, he could begin fabricating the motherboard prototype that same night.

He shut his laptop, walked out of the office, and entered the lab, to check on his team’s progress on the remaining nine non-volatile DRAM-based NVMe.